Core: Chipboard P2 18 mm
Deck: bothsides HPL 0.8 mm
Format: 3050 × 1220mm raw edges no cut to size
Glue : PVAC white glue D3 (D4 possible in request)
Chipboard
with BROSZEIT HPL Basics solid

Core: Chipboard P2 18 mm
Deck: bothsides HPL 0.8 mm
Format: 3050 × 1220mm raw edges no cut to size
Glue : PVAC white glue D3 (D4 possible in request)